Abstract:The CMS pixel detector is the innermost tracking device at the LHC, reconstructing the interaction vertices and charged particle trajectories. The current planar sensors located in the innermost layer of the pixel detector will be exposed to very high fluences which will degrade their performances. 3D pixel detectors are considered as a possible replacement of planar pixel sensors for the super-LHC due to their better performances in a harsh radiation environment. The 3D sensors were bump bonded to the CMS pixel readout chip and characterized in the laboratory before they were placed in a beam test at the Fermilab muon testbeam facility. I will present the laboratory and beam test results for the 3D sensors.